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 S T U/D1224N
S amHop Microelectronics C orp. Dec 20,2004
N-C hannel E nhancement Mode Field E ffect Trans is tor
P R ODUC T S UMMAR Y
V DS S
24V
F E AT UR E S
( m [ ) Max
ID
12A
R DS (ON)
S uper high dense cell design for low R DS (ON).
80 @ V G S = 4.5V 130 @ V G S = 2.5V
R ugged and reliable. TO-252 and TO-251 P ackage.
D
D G S
G D
S
G
S TU S E R IE S TO-252AA(D-P AK)
S TD S E R IE S TO-251(l-P AK)
S
AB S OL UTE MAXIMUM R ATINGS
P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous a @ TJ=25 C b -P ulsed Drain-S ource Diode Forward C urrent a Maximum P ower Dissipation a Operating Junction and S torage Temperature R ange
(TA=25 C unles s otherwis e noted)
S ymbol VDS VGS ID IDM IS PD TJ, TS TG Limit 24 12 12 25 10 50 -55 to 150 Unit V V A A A W C
THE R MAL C HAR AC TE R IS TIC S
Thermal R esistance, Junction-to-C ase Thermal R esistance, Junction-to-Ambient
1
R JC R JA
3 50
C /W C /W
S T U/D1224N
E LE CTR ICAL CHAR ACTE R IS TICS (TA =25 C unless otherwise noted)
Parameter OFF CHAR ACTE R IS TICS
Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BVDSS IDSS IGSS VGS(th) R DS (ON) ID(ON) gFS CISS COSS CRSS
c
S ymbol
Condition
VGS = 0V, ID = 250uA VDS = 18V, VGS = 0V VGS = 12V, VDS = 0V VDS = VGS, ID = 250uA VGS =4.5V, ID = 6.0A VGS =2.5V, ID = 5.2A VDS = 5V, VGS = 4.5V VDS = 10V, ID = 6.0A
Min Typ C Max Unit
24 1 100 0.7 1.2 60 90 15 10 528 139 107 1.8 80 130 V uA nA V
m-ohm m-ohm
ON CHAR ACTE R IS TICS b
Gate Threshold Voltage Drain-S ource On-S tate R esistance On-S tate Drain Current Forward Transconductance
A S
PF PF PF
DYNAMIC CHAR ACTE R IS TICS c
Input Capacitance Output Capacitance R everse Transfer Capacitance VDS =8V, VGS = 0V f =1.0MHZ
S WITCHING CHAR ACTE R IS TICS
Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Qgs Qgd
VDD = 10V ID = 1A VGEN = 4.5V R L = 10 ohm RGEN = 6 ohm VDS=10V,ID =6A,VGS=10V VDS=10V,ID =6A,VGS=4.5V VDS =10V, ID = 6A VGS =10V
2
13.7 8.9 25.4 14.1 14.5 7.2 1.3 2.1
ns ns ns ns nC nC nC nC
S T U/D1224N
E LE CTR ICAL CHAR ACTE R IS TICS (TA=25 C unless otherwise noted)
Parameter
5
Diode Forward Voltage
S ymbol
VSD
Condition
VGS = 0V, Is =10A
Min Typ Max Unit
1 1.3 V
C
DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS b
Notes a.S urface Mounted on FR 4 Board, t 10sec. b.Pulse Test:Pulse Width 300us, Duty Cycle 2%. c.Guaranteed by design, not subject to production testing.
10
V G S =10,9,8,7,6,5,4,3V
25 25 C 20
8
ID, Drain C urrent(A)
ID, Drain C urrent (A)
-55 C 15 T j=125 C
6 V G S =2V 4 2 0
10
5 0 0.0
0
2
4
6
8
10
12
0.6
1.2
1.8
2.4
3.0
3.6
V DS , Drain-to-S ource Voltage (V )
V G S , G ate-to-S ource Voltage (V )
F igure 1. Output C haracteris tics
2.2 1500 1.8 1200 900 600 C is s 300 0 C rs s 0 2 4 6 8 10 12 C os s
F igure 2. Trans fer C haracteris tics
V G S =4.5V ID=6A
RDS(ON), On-Resistance (Normalized)
C , C apacitance (pF )
1.4 1.0 0.6 0.2 0
-50
-25
0
25
50
75
100 125 T j( C )
V DS , Drain-to S ource Voltage (V )
F igure 3. C apacitance
F igure 4. On-R es is tance Variation with Temperature
3
S T U/D1224N
B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -50 -25 0 25 50 75 100 125 V DS =V G S ID=250uA 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 ID=250uA
T j, J unction T emperature ( C )
T j, J unction T emperature ( C )
F igure 5. G ate T hres hold V ariation with T emperature
24
F igure 6. B reakdown V oltage V ariation with T emperature
20
gFS , T rans conductance (S )
16 12 8 4 0 V DS =10V 0 5 10 15 20 25
Is , S ource-drain current (A)
20
10
1 0 0.4 0.6 0.8 1.0 T J =25 C 1.2 1.4
IDS , Drain-S ource C urrent (A)
V S D, B ody Diode F orward V oltage (V )
F igure 7. T rans conductance V ariation with Drain C urrent
10
ID, Drain C urrent (A)
F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent
40
V G S , G ate to S ource V oltage (V )
8 6 4 2 0 0
VDS =10V ID=6A
10
R
DS
(O N
) Li
m it
10
10 0m s
ms
11
DC
1s
0.1 0.03
VGS =4.5V S ingle P ulse T c=25 C 0.1 1 10 20 50
2
4
6
8
10 12 14 16
Qg, T otal G ate C harge (nC )
V DS , Drain-S ource V oltage (V )
F igure 9. G ate C harge
F igure 10. Maximum S afe O perating Area
4
S T U/D1224N
V DD ton V IN D VG S R GE N G
90%
toff tr
90%
RL V OUT
td(on) V OUT
td(off)
90% 10%
tf
10%
INVE R TE D
6
S
V IN
50% 10%
50%
P ULS E WIDTH
F igure 11. S witching T es t C ircuit
F igure 12. S witching Waveforms
2
r(t),Normalized E ffective T ransient T hermal Impedance
1 D=0.5
0.2 0.1 0.1 0.05 0.02 0.01 S ING LE P ULS E 0.01 10
-5 -4 -3 -2 -1
P DM t1 1. 2. 3. 4. 10 10 10 t2
R cJ A (t)=r (t) * R cJ A R cJ A=S ee Datas heet T J M-T A = P DM* R cJ A (t) Duty C ycle, D=t1/t2 1 10
10
S quare Wave P uls e Duration (s ec)
F igure 13. Normalized T hermal T rans ient Impedance C urve
5
S T U/D1224N
6
S T U/D1224N
5 95 7 84 9 6.00
35 05 85 0.94 4 3 0
9 7 30 3 9 36
3 41 3 3 5 1
4
L2
2.29 9.70 1.425 0.650 0.600
BSC 1 1.625 0.850 REF.
0.090 82 56 6 0.024
BSC 398 0.064 33 REF.
6
S T U/D1224N
TO-251 Tube
TO251 Tube/TO-252 Tape and Reel Data
" A"
TO-252 Carrier Tape
UNIT:P PACKAGE TO-252 (16 P) A0 6.80 O0.1 B0 10.3 O0.1 K0 2.50 O0.1 D0 r2 D1
r1.5 + 0.1 -0
E 16.0 0.3O
E1 1.75 0.1O
E2 7.5 O0.15
P0 8.0 O0.1
P1 4.0 O0.1
P2 2.0 O0.15
T 0.3 O0.05
TO-252 Reel
S
UNIT:P TAPE SIZE 16 P REEL SIZE r 330 M r330 O 0.5 N r97 O 1.0 W
17.0 + 1.5 -0
T 2.2
H
r13.0 + 0.5 - 0.2
K 10.6
S 2.0 O0.5
G
R
V
8


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